Fabrication of Capacitive Micromachined Ultrasonic Transducers Based on Adhesive Wafer Bonding Technique----系统科学研究所

学术报告

Fabrication of Capacitive Micromachined Ultrasonic Transducers Based on Adhesive Wafer Bonding Technique
主讲：姚智伟教授( University of Waterloo)
举办时间：2016.3.10;10:00am 地点：N205

Abstract: This talk reports the fabrication process of wafer bonded capacitive micromachined ultrasonic transducers (CMUTs) using photosensitive benzocyclobutene as polymer adhesive. Compared with direct bonding and anodic bonding, adhesive bonding by applying polymer adhesive provides good tolerance to wafer surface defects and contamination. In addition, the low process temperature of 250°C is compatible with standard CMOS processes. Single-element CMUTs consisting of cells with a diameter of 46 µm and a cavity depth of 700nm were fabricated. In-air and immersion acoustic characterization were performed on the fabricated CMUTs, demonstrating the capability of transmitting and receiving ultrasound signals. An in-air resonance frequency of 5.5 MHz was measured by a vibrometer under a bias voltage of 300 V. Both the ultrasound transmitting and receiving abilities were demonstrated by immersion tests. A center frequency of 3.0 MHz with a 129.9% -3 dB fractional bandwidth was measured in a pitch-catch test. A receive test involving two CMUT elements showed a center frequency of 3.1 MHz with a 139.9% -6 dB fractional bandwidth.

CV: John T. W. Yeow received the B.A.Sc. degree in electrical and computer engineering, and M.A.Sc. and PhD. degrees in mechanical and industrial engineering from the University of Toronto, Toronto, ON, Canada, in 1997, 1999, and 2003, respectively. He is currently a Faculty Member in the Department of Systems Design Engineering at University of Waterloo, Waterloo, ON, Canada. His current research interests are in the field of developing miniaturized biomedical instruments. He is a recipient of the Professional Engineering Ontario Engineering Medal, Natural Science & Engineering Research Canada Innovation Challenge Award, Douglas R. Colton’s Medal of Research Excellence, Micralyne Microsystems Design Award, Ontario Ministry of Research and Innovation’s Early Researcher Award, and University of Toronto Alumni Association 7T6 Early Career Award. He is currently a Canada Research Chair in Micro/Nanodevices. He is the Editor-in-Chief of the IEEE Nanotechnology Magazine, and an Associate Editor of the IEEE Transactions of Nanotechnology. He is a Fellow of the Engineering Institute of Canada

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